Feature
- Circuits can be formed by cutting and peeling the cross wiring.
- Secondary Holes are drilled for easy cutting into desired shapes.
- The 0.6 mm thickness provides some rigidity, but also some flexibility.
- Secondary Holes are drilled to mount it to the enclosure or to pass wires through.
Product Attributes
Primary Holes
Plating | Plated Through Hole (PTH) |
Pitch | 2.54mm Grid |
Circuit Pattern | Round Pad Per Hole & Cross Wiring, Both Sides |
Hole Diameter | 1.0mm |
Pad Diameter | 1.5mm |
Cross Wiring Width | 0.25mm |
Secondary HoleS
Plating | Non-Plated Through Hole (NPTH) |
Pitch | 2.54mm Grid |
Circuit Pattern | None |
Hole Diameter | 1.6mm |
Board Specification
Series | MED BB |
Size / Dimension | 100mm x 100mm |
Board Thickness | 0.6mm |
Material | FR4-TG 150 (KB6165F) |
Outer Layer Copper Foil Thickness | 1oz |
Surface Treatment | Electroless Nickel Immersion Gold (ENIG) 1U” |